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  May 2018  
 
     
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Innovation and Technology Scholarship Award Scheme 2018 Award Presentation Ceremony
Organised by the Hong Kong Federation of Youth Groups, and jointly supported and sponsored by the Innovation and Technology Commission and The Hongkong and Shanghai Banking Corporation Limited respectively, the Innovation and Technology Scholarship Award Scheme (the Scheme) has been running since 2011. Twenty-five innovative-minded university students are selected every year, and each is awarded a scholarship capped at HKD$150,000. Tailor-made training programmes are also provided to help them achieve their “tech” dreams.

On April 23, the Award Presentation Ceremony for this year’s scheme was held at the Hong Kong Convention and Exhibition Centre. The 25 outstanding undergraduates from different streams of study, including science, engineering, computer and health-related disciplines, were awarded scholarships for their passion and relentless effort in the pursuit of knowledge in innovation and technology (I&T). Within the coming year, they will be offered an attachment in the world’s top overseas or Mainland institutes. In addition, the Scheme also provides awardees with the opportunities to take an internship locally and make use of what they have learned to apply to local community work.

At the award presentation ceremony, Mr Nicholas Yang, Secretary for Innovation and Technology, stated, “By participating in world-acclaimed overseas or Mainland universities, and pairing with reputable academic or professional mentors, the Scheme helps expand the network of awardees and widen their horizons. Many of the past awardees have already begun, or are embarking, on their careers in I&T, and are inspiring more young people to pursue a career in the field.”

The Scheme nurtures young talent in the I&T industry and facilitates the development of Hong Kong’s I&T sector. To date, the Scheme has cumulatively awarded 200 local students. More details about the Scheme can be found here.

 
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The Forum on Mainland-Hong Kong Cooperation in Innovation and Technology organised by the Hong Kong Special Administrative Region (HKSAR) Government on May 15 was attended by over 100 academicians from the Chinese Academy of Sciences (CAS) and the Chinese Academy of Engineering (CAE), as well as representatives of the HKSAR Government and the technology sector.
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The Government will roll out a Pilot Technology Talent Admission Scheme (TechTAS) for three years. In order to meet the needs of the innovation and technology (I&T) sector in getting talented staff, the scheme provides a fast-track arrangement for eligible technology companies/institutes to admit overseas and Mainland research and development talent.
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AlterEgo, a computer interface developed by Massachusetts Institute of Technology (MIT) researchers, can transcribe words that the user vocalises internally. The system is comprised of a wearable intelligence-augmentation (IA) device and an associated computing system, enabling humans to converse in high-bandwidth natural language with machines, artificial intelligence (AI) assistants and other people without necessarily speaking nor externally perceptible movements of the mouth.
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Upcoming I&T Event
 
  1. "The Guangdong-Hong Kong Technology Co-operation Funding Scheme" (TCFS), launched by the Hong Kong/Guangdong Expert Group on Co-operation in Innovation and Technology, aims at enhancing collaboration between the universities, research institutes and technology enterprises in Hong Kong and Guangdong, and upgrading the technological level of industries in the Greater Pearl River Delta region. The 2018 TCFS is now open for applications and will close on June 15, 2018. Click here for more details.
  2. The Hong Kong IoT Conference 2018 will cover a wide range of topics in "Smart Healthcare", "Smart Business" and "Smart Mobility", and will provide industry practitioners with an opportunity to discover how IoT can be adapted to meet different market needs, and to exchange their views and expertise with each other. The conference will take place on June 6, 2018 at the Hong Kong Convention and Exhibition Centre. Click here for more details.
  3. With the theme of "Collaborate for Success", the Belt and Road Summit will bring senior government officials, representatives of international institutions, business leaders and industry experts from countries along or beyond the Belt and Road together to exchange views on multilateral co-operation and explore new business opportunities arising from the Belt and Road Initiative. The summit will take place on June 28, 2018 at the Hong Kong Convention and Exhibition Centre. Click here for more details.
 
 
 
 
Enquiries & Comments
 
Innovation and Technology Commission
21/F, West Wing, Central Government Offices, 2 Tim Mei Avenue, Tamar, Hong Kong.

email : enquiry@itc.gov.hk
 
tel : (852) 3655 5856
fax : (852) 2730 4633
 
   
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