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  May 2018  
 
     
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“Pilot Technology Talent Admission Scheme” will be rolled out to recruit I&T talent
The Government will roll out a Pilot Technology Talent Admission Scheme (TechTAS) for three years. In order to meet the needs of the innovation and technology (I&T) sector in getting talented staff, the scheme provides a fast-track arrangement for eligible technology companies/institutes to admit overseas and Mainland research and development talent.

As a start, the TechTAS will be open to tenants and incubatees of the Hong Kong Science and Technology Parks Corporation (HKSTPC) and Cyberport that are engaged in the areas of biotechnology, artificial intelligence, cybersecurity, robotics, data analytics, financial technologies and material science. Each technology company and institute that is successful in its application will be given an admission quota of not more than 100 persons a year for bringing in such people, and a maximum of 1,000 persons will be admitted in the first year of operation.

The Innovation and Technology Commission will decide whether to approve a quota request after taking into account recommendations from the HKSTPC/Cyberport. It is aimed to complete the processing within two weeks, if the applicant technology company or institute provides all of the information required. Successful applicant companies being identified as a candidate fitting the requirements in the allotted quota (including the main job duties, academic qualifications, technical skills, work experience and the remuneration package) can then apply directly to the Immigration Department to sponsor the employment visa or entry permit application of the non-local recruit. Subject to satisfactory documentation, the normal processing time for issuing the visa or entry permit would be about two weeks.

The Secretary for Innovation and Technology, Mr Nicholas Yang, said, "Talent is a key success factor in the global innovation race. Hong Kong must adopt policies to assist the industry in securing the professionals needed. Pooling together technology experts is indeed one of the eight major areas announced by the Chief Executive in the Policy Address to drive Hong Kong's I&T development. The TechTAS is designed to substantively streamline the admission procedure and shorten the processing time. It will effectively help technology companies and institutes in recruiting technology talent that is in short supply locally, from overseas and the Mainland, which is of critical importance in the development of I&T".

The TechTAS will also help nurture local talent. It requires applicant technology companies and institutes to employ one new local full-time employee plus two local interns engaging in technology-related work for every three non-local persons admitted.

The persons admitted under the TechTAS should be degree holders in science, technology, engineering or mathematics (STEM) from a well-recognised university. Work experience is not compulsory for those with a master's or doctoral degree, while those with a bachelor's degree only should possess a minimum of one year of work experience in the relevant technology area.

Briefings on the TechTAS will be arranged for tenants and incubatees of the HKSTPC and Cyberport between late May and mid-June and it is targeted to invite applications in June 2018. Please click here for more details about the scheme.



 
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Organised by the Hong Kong Federation of Youth Groups, and jointly supported and sponsored by the Innovation and Technology Commission and The Hongkong and Shanghai Banking Corporation Limited respectively, the Innovation and Technology Scholarship Award Scheme (the Scheme) has been running since 2011. Twenty-five innovative-minded university students are selected every year, and each is awarded a scholarship capped at HKD$150,000. Tailor-made training programmes are also provided to help them achieve their “tech” dreams.
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The Forum on Mainland-Hong Kong Cooperation in Innovation and Technology organised by the Hong Kong Special Administrative Region (HKSAR) Government on May 15 was attended by over 100 academicians from the Chinese Academy of Sciences (CAS) and the Chinese Academy of Engineering (CAE), as well as representatives of the HKSAR Government and the technology sector. The forum focuses on the new opportunities which will be brought about by the Ministry of Science and Technology (MOST) and Ministry of Finance science and technology funding, for application by Hong Kong higher education and research institutions.
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AlterEgo, a computer interface developed by Massachusetts Institute of Technology (MIT) researchers, can transcribe words that the user vocalises internally. The system is comprised of a wearable intelligence-augmentation (IA) device and an associated computing system, enabling humans to converse in high-bandwidth natural language with machines, artificial intelligence (AI) assistants and other people without necessarily speaking nor externally perceptible movements of the mouth.
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Upcoming I&T Event
 
  1. "The Guangdong-Hong Kong Technology Co-operation Funding Scheme" (TCFS), launched by the Hong Kong/Guangdong Expert Group on Co-operation in Innovation and Technology, aims at enhancing collaboration between the universities, research institutes and technology enterprises in Hong Kong and Guangdong, and upgrading the technological level of industries in the Greater Pearl River Delta region. The 2018 TCFS is now open for applications and will close on June 15, 2018. Click here for more details.
  2. The Hong Kong IoT Conference 2018 will cover a wide range of topics in "Smart Healthcare", "Smart Business" and "Smart Mobility", and will provide industry practitioners with an opportunity to discover how IoT can be adapted to meet different market needs, and to exchange their views and expertise with each other. The conference will take place on June 6, 2018 at the Hong Kong Convention and Exhibition Centre. Click here for more details.
  3. With the theme of "Collaborate for Success", the Belt and Road Summit will bring senior government officials, representatives of international institutions, business leaders and industry experts from countries along or beyond the Belt and Road together to exchange views on multilateral co-operation and explore new business opportunities arising from the Belt and Road Initiative. The summit will take place on June 28, 2018 at the Hong Kong Convention and Exhibition Centre. Click here for more details.
 
 
 
 
Enquiries & Comments
 
Innovation and Technology Commission
21/F, West Wing, Central Government Offices, 2 Tim Mei Avenue, Tamar, Hong Kong.

email : enquiry@itc.gov.hk
 
tel : (852) 3655 5856
fax : (852) 2730 4633
 
   
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